HALE Array

Features
& Benefits

MicroLink Devices’ HALE/UAV array incorporates its 20cm² IMM triple-junction cells into a high packaging density array specifically designed for high-altitude aircraft.  It is encapsulated on both sides for protection from the elements typically encountered in stratospheric flights.  The array comes with welded interconnects, blocking and bypass diodes.  In addition, the array can come with an adhesive backing sheet for ease of integration into your platform.  MicroLink Devices can also assist in solar layout design and integration.

  • Fully encapsulated, with welded interconnects and blocking diodes.
  • Panel power density >270 W/m² (under 1000 W/m²).
  • Areal mass density <232 g/m² (under 1000 W/m²).
  • Specific power >1105 W/kg (under 1000 W/m²).
  • Available in multiple packaging designs for both lightweight UAV/HALE (<250 g/m²) and robust portable power applications.
  • Sheet size, layout, and electrical characteristics are customisable to meet customer requirements.
  • Sheet conforms to curved surfaces.
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